Automatische Void-Analyse auf Röntgenbildern von Elektronikteilen
This application uses Artificial Intelligence (AI) to detect/recognize soldered regions in x-ray images of electronics parts. It further processes these parts to find the voids and inclusions inside the soldered region.
A detailed analysis report (including area of each void, percentage of voids in each solder etc.) can be generated with the desktop version of the application.