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Espec Technologies Pte Ltd has more than 20 years in the PCB industry, providing a one-stop solution from PCB design, PCB and PCBA for both commercial and BIB boards. We supply a wide array of products including Rigid , Rigid Flex, Flex, Metal PCB, Substrate, BIB,MCC, Probe card and Load board. We are also ISO9002, ISO14001, TS16949& UL certified.
Our Production Capabilities:
Up to 66 layer
High aspect ratio of 36
Fine pitch eg. 0.35mm
High copper thickness of 10 oz
Exotic material : Roger; Polymide ; Nelco
Our SMT Capabilities
PCB Max. Size: 300mm(L)×250mm(W)×4.0mm(T)
PCB Min. Size: 50mm(L) ×50mm(W)×0.3mm(T)
Component Min. Size: 01005(0.4mm×0.2mm)
IC Min. Space: 0.2mm
BGA Ball Space: Min. 0.25mm, Max.1.50mm
BGA Ball Dia.: Min. 0.10mm, Max.0.63mm
Min. space between component: 0.1mm
Capacity/Day: 5.5KK/Chip
BGA, Micro BGA, SOIC, PLCC and QFP types of packaged assemblies.
Support SMT/CSP/COB and Assembly process
最新版本1.23.40.93更新日志
Last updated on 2016年07月21日
Minor bug fixes and improvements. Install or update to the newest version to check it out!
翻译中...
Espec Technologies
1.23.40.93 by Spinn Labs
2016年07月21日